ECTC
Electronic Components and Technology Conference
data from OpenAlex · report generated 2026-11-01Data details
Reporting period: 2016–2025. Data fetched: 2026-11-01 11:51 UTC
The abstract percentage is the share of indexed papers with abstracts, not the completeness of conference proceedings.
Why some years are not used by default
- 2026 is not used by default: current or future calendar year; indexing may be incomplete.
Explicit year selections can include these editions; their counts may be incomplete.
Coverage by year
| Year | Papers | With abstract |
|---|---|---|
| 2016 | 393 | 99.0% |
| 2017 | 337 | 98.5% |
| 2018 | 366 | 99.7% |
| 2019 | 355 | 100.0% |
| 2020 | 355 | 97.7% |
| 2021 | 360 | 99.2% |
| 2022 | 361 | 100.0% |
| 2023 | 368 | 100.0% |
| 2024 | 381 | 100.0% |
| 2025 | 382 | 99.5% |
At a glance
- OpenAlex contains 3,658 papers for Electronic Components and Technology Conference between 2016 and 2025; output has been flat, between 337 and 393 papers a year.
- The fastest-growing phrase is “hybrid bonding”, up from 1.1% to 9.6% of papers.
- Samsung (South Korea) gained the most share among institutions (2.2% → 6.3%); South Korea among countries (6.3% → 10%).
- New vocabulary: wafer hybrid bonding, co-packaged optics, chip-on-wafer.
How the conversation changed
Share of papers matching the counting rule: the phrase appears in the title or more than once in the abstract. One phrase per family — variants such as “wafer hybrid bonding” are listed under it. Ranked by the gain between the first half of the period (2016–2020) and the second (2021–2025).
What is rising
1.1% → 9.6%
also , ,
0.4% → 4.0%
1.9% → 4.6%
0.8% → 3.0%
What is fading
A falling share measures a change in vocabulary, not necessarily a decline in the technique’s use.
6.6% → 2.6%
also ,
4.7% → 3.1%
3.2% → 1.9%
also
1.6% → 0.3%
New vocabulary
Phrases that were almost absent before 2021 and now appear in at least one paper in a hundred. ✚ marks the first year a phrase shows up.
Phrase details
OpenAlex · paper-trends
How the field's topics shifted
“hybrid bonding / wafer / pitch” grew from 11% to 21% of papers, while “flexible / electronics / conductive” fell from 20% to 15%.
OpenAlex · paper-trends
- — flexible, electronics, conductive, printed, materials, silver (643 papers)
- — bonding, cu, hybrid bonding, hybrid, wafer, pitch (579 papers)
- — fan, level, rdl, wafer, wafer-level, packaging (545 papers)
- — model, reliability, stress, finite, finite-element, element (530 papers)
- — power, design, performance, interposer, system, silicon (468 papers)
Show all topics
- — solder, sn, joints, joint, solder joints, cu (366 papers)
- — antenna, loss, frequency, wave, band, 5g (301 papers)
- — optical, photonic, coupling, fiber, waveguide, waveguides (224 papers)
Who publishes
Papers with at least one author at the institution (a paper counts once per institution; subsidiaries and institutes are credited to their parent). The arrow is the change in share of papers between the two halves of the period.
Institution details
OpenAlex · paper-trends